BGA-Substrat

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Schicht ENEPIG BTs FR4 NAND Memory Substrate Board 35/35um 4

Preis: US 120-150 per square meter

MOQ: 1 square meter

Lieferzeit: 7-10 working days

Marke: Horexs

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Markieren:NAND Memory Substrate Board, BT FR4 Memory Substrate Board, ENEPIG FR4 Package Substrate

Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohmeg... Mehr sehen

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IC-Paket-Substrat

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eMMC IC-Paket-Substrat PWB

Preis: US 120-150 per square meter

MOQ: 1 square meter

Lieferzeit: 7-10 working days

Marke: Horexs

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Markieren:eMMC IC Package Substrate PCB, IC Package Substrate eMMC, eMMC PCB

eMMC IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC ... Mehr sehen

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Schlückchen-Paket-Substrat

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Stapeln Sie über/über füllendes Schlückchen-Paket-Substrat BT, das materielle 4L heterogenes System kombinieren

Preis: US 99-120 each piece

MOQ: 1 square meter

Lieferzeit: 7-10 working days

Marke: Horexs

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Markieren:Stack Via Sip Package Substrate, Via Filling Sip Package Substrate, BT Sip Package Substrate

stack via/via filling Sip package substrate production supporting SiP (System in Package) SiP is the substrate that enables active devices with different functions to provide multi-functions associated with a system or sub-system in one single package. It is essential to next-generation package for ... Mehr sehen

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FCCSP-Paket-Substrat

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BTs FCCSP Grün-Farbe des Paket-Substrat-3x3mm für Flip Chip Assembly

Preis: US 85-100 per square meter

MOQ: 1 square meter

Lieferzeit: 7-10 working days

Marke: Horexs

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Markieren:Green FCCSP Package Substrate, 3x3mm FCCSP Package Substrate, 0.3mm FCCSP Package Substrate

FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,others; Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications... Mehr sehen

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Sensor-Substrat

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Halbleiter-Sensor-Substratfertigung

Preis: US 0.1-0.12 each piece

MOQ: 1000pieces

Lieferzeit: 7-10 working days

Marke: Horexs

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Markieren:Fingerprint Recognition PCB Board Fabrication, UL Fingerprint Recognition PCB, Fingerprint Recognition PCB For Intelligent Lock

Application:Fingerprint recognition electronics,IoT electronics,Semiconductors ,Semiconductor,IC package,Consumer electronics,Car electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.17mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki... Mehr sehen

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Rf-Modul-Substrat

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Materielles weiches Gold des Rf-Modulsubstratwiderstandsteuer 4L BT

Preis: US 0.089-0.109 each piece

MOQ: 1000pieces

Lieferzeit: 7-10 working days

Marke: Horexs

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Markieren:Goldfinger Fingerprint Recognition PCB, FR4 Fingerprint Recognition PCB, 0.15mm Fingerprint Recognition PCB

Application:Semiconductor package,IC package,WIFI module/Bluetooth module,Others; Spec.of Substrate production: Mini.Line space/width:1mil (35um) Finished thickness:0.21mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; S... Mehr sehen

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Gedächtnis-Substrat

(21)

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Karten-Substratproduktion 4Layer MicroSD

Preis: US 120-150 per square meter

MOQ: 1 square meter

Lieferzeit: 7-10 working days

Marke: Horexs

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Markieren:Rohs Pcb Gold Finger Plating, High Density Pattern Pcb Gold Finger, Custom Pcb Gold Finger Plating

Description Of IC Substrate pcb IC Package Substrate, IC Package Substrate, is a key carrier in the packaging and testing process, used to establish signal connections between IC and PCB, in addition to protecting circuits, fixing lines, and dissipating residual heat. Application: ​NAND memory Flash... Mehr sehen

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MEMS-Substrat

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Substratfertigung Substrates Soem-ODM BT des Material-MEMS/CMOS mehrschichtige

Preis: US 120-150 per square meter

MOQ: 1 square meter

Lieferzeit: 7-10 working days

Marke: Horexs

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Markieren:OEM MEMS PCB, ODM MEMS PCB, BT Multilayer Circuit Board

Ultrathin MEMS PCB use OhmegaPly Cooper Foil and Mitsui Core Material Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) fini... Mehr sehen

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IoT-Substrat

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BGA-/QFNpaket-Substratproduktion für IoT-Industriehalbleiter

Preis: US 0.1-0.12 each piece

MOQ: 1000pieces

Lieferzeit: 7-10 working days

Marke: Horexs

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Markieren:4 Layer Camera Module PCB, Horexs Camera Module PCB, Horexs 4 Layer PCB

Application:Smart electronics,Smart healthy electronics,Smart agricultural electronics,IoT industry electronics,Smart express electronics ,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuis... Mehr sehen

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Anderes ultradünnes Substrat

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Mikroelektronik IC-Substratfertigung

Preis: US 95-120 per square meter

MOQ: 1 square meter

Lieferzeit: 7-10 working days

Marke: Horexs

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Markieren:Halogen Free PCB Circuit Board, ODM PCB Circuit Board, Bonding Halogen Free PCB

Application:Memory card/UDP,IC substrate.IC package,IC assembly,TF card,MrcroSD card;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.28mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4... Mehr sehen

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Ultradünnes steifes PWB

(16)

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Substratfertigung des FR4 Kernspeichers IC

Preis: US 0.089-0.109 each piece

MOQ: 1000pieces

Lieferzeit: 7-10 working days

Marke: Horexs

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Markieren:0.4mm Electronic Printed Circuit Board, Smooth Solder Resist Printed Circuit Board, 0.4mm Printed Circuit Board

Description Of IC Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold wire bonding substrate. Application: ​Memory electronics MicroSD TF card IC Package,Semiconductors electronics Semiconductor IC package S... Mehr sehen

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PWB der medizinischen Ausrüstung

(1)

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Gesundheitswesenelektronik-/Mikro-Anhörungselektronik-PWB-Fertigung

Preis: US 85-120 each square meter

MOQ: 10 squre meters

Lieferzeit: 7-10 working days

Marke: Horexs

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Markieren:0.2mm Medical Equipment PCB, Highly Intensive Medical Equipment PCB, 0.2mm Routed Circuit Board

Application:healthy electronics,Microelectronics devices,others; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Othe... Mehr sehen

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