FCCSP-Paket-Substrat
(8)
BTs FCCSP Grün-Farbe des Paket-Substrat-3x3mm für Flip Chip Assembly
Preis: US 85-100 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Green FCCSP Package Substrate, 3x3mm FCCSP Package Substrate, 0.3mm FCCSP Package Substrate
FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,others; Applicable up to 35µm pitch for flip-chip assembly (peripheral) Thin build-up laminate for SiP applications... Mehr sehen
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FCCSP-Substratfertigung, die China stützt
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Gold Plating Soldermask Antenna PCB, 0.1mm Antenna PCB, 0.1mm 4 Layer PCB
Application:Consumer electronics,Internet electronics,telcommunication electronics,Others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.4mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,O... Mehr sehen
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Flip Chips CSP grüne Farbe-BT-Material des Paket-Substrat-5x5mm
Preis: US 85-100 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:CSP package substrate, 5x5mm CSP package substrate, BT FCCSP Package Substrate
Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,PC/Server : DRAM, SRAM,Smart Mobile Devices ,AP, Baseband, Finger print sensor, etc.Network : Bluetooth, RF... Mehr sehen
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Hochleistungs-FCCSP/FCBOC-Paketsubstrat für PC/Server-DRAM und SRAM/LPDDR
Preis: US 85-100 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Green CSP package substrate, BT CSP package substrate, BT PBGA package substrate
PBGA / CSP package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & controllers, Gate Arrays, Memory, DSPs, PLDs,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electroni... Mehr sehen
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FCCSP-Paketsubstrat 4L Anhäufungsarten ENEPIG
Preis: US 85-100 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:0.2mm Antenna Circuit Board, Intelligent Handwriting Antenna Circuit Board, Large 0.2mm Antenna PCB
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Tacon... Mehr sehen
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Halbleiter FCCSP Paket-Substratfertigung
Preis: US 85-100 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Necl... Mehr sehen
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BTs FCCSP Grün-Farbe des Paket-Substrat-3x3mm für Flip Chip Assembly
Preis: US 85-100 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Green Color FCCSP Package Substrate, Flip Chip FCCSP Package Substrate, BT FCCSP Substrate
FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts st... Mehr sehen
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0.3mm FCCSP Anhäufungs-Arten Material des Paket-Substrat-4L ENEPIG 5*5mm BT
Preis: US 85-100 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:ENEPIG FCCSP package substrate, Buildup Types FCCSP package substrate, 0.3mm FCCSP substrate
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Tacon... Mehr sehen
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