IoT-Substrat
(3)
BGA-/QFNpaket-Substratproduktion für IoT-Industriehalbleiter
Preis: US 0.1-0.12 each piece
MOQ: 1000pieces
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:4 Layer Camera Module PCB, Horexs Camera Module PCB, Horexs 4 Layer PCB
Application:Smart electronics,Smart healthy electronics,Smart agricultural electronics,IoT industry electronics,Smart express electronics ,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuis... Mehr sehen
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Kamera-Modulsubstratfertigung, die China stützt
Preis: US 0.1-0.12 each piece
MOQ: 1000pieces
Lieferzeit: 7-10 working days
Marke: Horexs
Application:Camera modules electronics,modules electronics,Consumer electronics,Sensors electronics,Semiconductor package; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola... Mehr sehen
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QFN-Paket-Sensor-Substratfertigungsunterstützung
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:0.2mm Camera Module PCB, Immersion Gold Camera Module PCB, 0.2mm Module PCB Board
Application:Semiconductor package,Sensors electronics package,QFN package,Sensors electronics,Smart electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.2mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,... Mehr sehen
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