Substratfertigung des FR4 Kernspeichers IC
Preis: US 0.089-0.109 each piece
MOQ: 1000pieces
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:0.4mm Electronic Printed Circuit Board, Smooth Solder Resist Printed Circuit Board, 0.4mm Printed Circuit Board
Description Of IC Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 (170tg),ENIG gold wire bonding substrate. Application: Memory electronics MicroSD TF card IC Package,Semiconductors electronics Semiconductor IC package S... Mehr sehen
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Schicht ENEPIG BTs FR4 NAND Memory Substrate Board 35/35um 4
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:NAND Memory Substrate Board, BT FR4 Memory Substrate Board, ENEPIG FR4 Package Substrate
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohmeg... Mehr sehen
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0.1mm 0.4mm dünnes PWB Stärke-L/S 35um ultra
Preis: US 0.11-0.13 each piece
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:50um Line Space Ultra Thin Pcb, 0.4mm Ultra Thin Pcb, 0.1mm Ultra Thin Pcb
Thickness 0.1-0.4mm Ultralthin PCB With Minimum 25um Line Width And 50um Line Space Application:writing pad/touch pad,consumer electronics,Smart electronics; Mini.Line space/width:1mil (25um) Spec.of pcb production: FR4 (0.15mm) finished thickness; FR4 brand:SHENGYI or customize; Surface finished:im... Mehr sehen
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Mikroelektronik IC-Substratfertigung
Preis: US 95-120 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Halogen Free PCB Circuit Board, ODM PCB Circuit Board, Bonding Halogen Free PCB
Application:Memory card/UDP,IC substrate.IC package,IC assembly,TF card,MrcroSD card;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.28mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4... Mehr sehen
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ultradünne steife Leiterplatte der Linienbreite-1mil
Preis: US 120-150 per square meter
MOQ: 100pieces
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Complex Rigid Printed Circuit Board, 1mil Line Width Printed Circuit Board, 1mil Line Width Rigid Circuit Board
Description Of IC Substrate pcb 0.12mm ultrathin FR4 print circuit boards is still belong to rigid FR4 pcb boards,ultrathin pcb boards. Application: Consumer electronics Spec.of pcb production: Mini.Line space/width 35/35um - 20/20um - 10/10um Finished Thk. 0.12mm Raw material SHENGYI,Mitsubishi,mi... Mehr sehen
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Mikroelektronikpaket-Substratfertigung
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Black Soldermask LED PCB Board, Black Soldermask led lamp pcb, LED PCB Board With total Pad
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPl... Mehr sehen
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Karten-Substratproduktion 4Layer MicroSD
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Rohs Pcb Gold Finger Plating, High Density Pattern Pcb Gold Finger, Custom Pcb Gold Finger Plating
Description Of IC Substrate pcb IC Package Substrate, IC Package Substrate, is a key carrier in the packaging and testing process, used to establish signal connections between IC and PCB, in addition to protecting circuits, fixing lines, and dissipating residual heat. Application: NAND memory Flash... Mehr sehen
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Stärke-ultra dünnes PWB-Brett IC-Versammlungs-0.2mm
Preis: US 0.11-0.13 each piece
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:0.2mm Ultra Thin Pcb, IC Assembly Ultra Thin Pcb, 0.2mm Thin Pcb Board
Thickness 0.1-0.4mm Ultralthin PCB with Halogen Free Material/gold plating Application:IC substrate/IC assembly/IC package/IoT electronics,Memory card more! Mini.Line space/width:1mil (25um) Spec.of pcb production: FR4 (0.1-0.4mm) finished thickness; Material of FR4 brand,Support customize;Support J... Mehr sehen
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Kundengebundene ultradünne steife PWB-Herstellung
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Ultrathin Rigid PCB Fabrication, Customized Ultrathin Rigid PCB, Customized Ultrathin Rigid PCB Fabrication
high quality gold plating ultrathin printed circuit board fabrication with customize/BT FR4/IC substrate Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,U... Mehr sehen
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Horexs 0.15mm 2 Schicht-PWB-Brett für Lithium-Batterie
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:0.15mm 2 Layer Pcb Board, Horexs 2 Layer Pcb Board, Horexs Pcb Board For Lithium Battery
0.15mm finished thickness High Precision Ultrathin PCB with Halogen Free Material,ROHS for Lithium Battery Application:Lithium Battery,0.15mm finished thickness FR4 PCB; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Ma... Mehr sehen
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BGA-Paket des Gedächtnis-Substrates mit weicher Oberfläche ENEPIG ENIG Gold
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:MicroSD BGA Substrate, TF Memory BGA Substrate, ENEPIG BGA Substrate
MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you send inquiry us,Pls be know that we have to get the following : 1-substrate production sepc. information; 2-Gerber files(substrate designer/engineer ca... Mehr sehen
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eMMC IC-Paket-Substrat PWB
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:eMMC IC Package Substrate PCB, IC Package Substrate eMMC, eMMC PCB
eMMC IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC ... Mehr sehen
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0.4mm ultradünnes steifes PWB
Preis: US 150-165 per square meter
MOQ: 10 squre meters
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:0.4mm Ultrathin Rigid PCB, Ultrathin Rigid PCB 0.4mm, 0.4mm Ultrathin PCB
0.4mm finished FR4 circuit boards fabrication with High Quality Gold Plating PCB Board Taiyo White Solder Mask ROHS Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC subs... Mehr sehen
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Halbleiter BTs materielles Pacakge-Substrat L/S 35/35um
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:BT FR4 BOC Pacakge Substrate, Improved Tenting BOC Pacakge Substrate, BOC Pacakge fr4 substrate
BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate,Semiconductor package; Spec.of pcb production: Mini.Line space/width 1mil (20um) Finished thickness BT (0.1-0.4mm) finished thickness Mainly brand SHENGYI... Mehr sehen
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Des Paketsubstrates Stärke BGA Horexs 0.2mm voller Harzstecker alle Löcher und Kappenüberzug
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:0.2mm Mini PCB Board, Horexs LED PCB Board, Horexs Mini PCB Board
Horexs 0.2mm Thickness full resin plug all holes and cap plating Application:MicroLED,MiniLED,LED display,LED displays; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsui... Mehr sehen
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MicroLED-/MiniLEDpaket-Substratfertigung
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Fine Pitch Micro Pcb Board, Micro Pcb Board No Chromatism, Fine Pitch Pcb For Outdoor Led
Fine Pitch Micro Pcb Board with none misregistration SR Application:LED display,LED displays,Lighting pcb,outdoor Led; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:BT/FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... Mehr sehen
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Mehrschichtige BT-Materialhalbleiterpaket-Substratfertigung
Preis: US 0.1-0.12 each piece
MOQ: 1000pieces
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:4 Layer fr4 circuit board, 0.3mm Rigid Circuit Boards, VCP Gold Plated Rigid Circuit Boards
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package,Memory electronics,NAND/Fl... Mehr sehen
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Ultradünne PWB-Fertigung Fingerabdruck-Identifizierungs-PWBs
Preis: US 180-210 per square meter
MOQ: 10 squre meters
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Substrate Printed Circuit Board, IC Package Substrate Circuit Board, Printed Circuit Board for Fingerprint Identification
Description Of IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. Additionally,the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of I... Mehr sehen
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ENEPIG-Halbleiterversammlung BGA Rohstoff Substrat-Hitachis BT
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Half Hole BGA Substrate, ENEPIG BGA Substrate, BT FR4 Package Substrate
Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubi... Mehr sehen
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Verpackensubstratherstellung ENIG-Draht-/Paket des Die-Bondes BGA Substrat ICs
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Wire Bond BGA Substrate, ENIG BGA Substrate, IC Packaging Substrate Board
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; M... Mehr sehen
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