310*320mm Panelgröße Panelstufe QFN Niedriger elektrischer Widerstand
Preis: Negotiable
MOQ: Negotiable
Lieferzeit: Negotiable
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and plac... Mehr sehen
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310*320mm Panelgröße Dünner MOS Chip Silizium Niedriger Stromverbrauch
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... Mehr sehen
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Verpackungsfläche auf Panellenebene nach unten-EWLB Hohe Wärmeverteilung Hohe Zuverlässigkeit
Preis: Negotiable
MOQ: Negotiable
Lieferzeit: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... Mehr sehen
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310*320mm-Fan-Out Panel Level Packaging (FOPLP) GaN-Produkt
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... Mehr sehen
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hohe Bildverhältnis TGV
Preis: Negotiable
MOQ: 10 panel
Lieferzeit: 1 month
Marke: FZX -TGV
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:1... Mehr sehen
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Paket geeignet für verschiedene Verpackungs-Simulationsversuche
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... Mehr sehen
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