China panel level packaging product structure

{"pid":"48011037","cid":"357172","pimg_url":"\/\/img1.tradegrowthhub.com\/ec\/49\/4956cffb0dbc\/product\/184423574_s-w400xh400.jpg","name":"FOPLP-Verpackung (Fan-Out Panel Level Packaging) Produktstruktur eingebettete Verpackung","company_name":"Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.","attrs":{"Preis":"Negotiable","MOQ":"3000pcs","Lieferzeit":"1 month","Marke":"FZX"}}