Verpackung auf der Ebene der Ausbreitungsplatte
(5)
310*320mm-Fan-Out Panel Level Packaging (FOPLP) GaN-Produkt
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... Mehr sehen
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310*320mm-Fan-Out-Panel Level Packaging (FOPLP) Funkfrequenz (RF)
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: Panel size:310*320mm Package size: 7*6mm Package thickness: 0.75mm Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the back of the plastic sealing material, t... Mehr sehen
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310*320mm-Fan-Out-Panel Level Packaging (FOPLP) MEMS-Mikrofonpaket
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: Plating uniformity: ≤10%; Package size: 3*2mm; Package thickness: 0.26mm; Chip size: 0.96*0.78mm; Process type: FOPLP (310X320mm); Applications: Mobile phone, Bluetooth headset,MEMS, wearable electronics. Specifications: Package size: 3*2mm; Package thickness: 0.26mm; Chip size: 0.96*0.... Mehr sehen
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310*320mm-Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the temporary carrier board, press EMC film, etching, then drill the hole, do electrode-plating. Applications: Mini-LED, lamps Specifications: Chip size 0.4... Mehr sehen
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310*320mm-Fan-Out-Panel Level Packaging (FOPLP) Leistungspaket
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process flow: face up encapsulation method is adopted. After a single patch, bump, plastic sealing and grinding (exposing the ball), then punch holes and electro... Mehr sehen
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