Experimente zur Simulation von Verpackungen
(1)
Paket geeignet für verschiedene Verpackungs-Simulationsversuche
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX
Description: 1. Support WBBGA, FCBGA, WLCSP, POP, FO, 2.5D and other package types of electromagnetic, thermal, structural and mode flow simulation. 2. From the electrical simulation of chip to system, SI analysis and PI analysis of package design are realized. 3. Key process feasibility simulation ... Mehr sehen
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