310*320mm Panelgröße Panelstufe QFN Niedriger elektrischer Widerstand
Preis: Negotiable
MOQ: Negotiable
Lieferzeit: Negotiable
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and plac... Mehr sehen
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Verpackungsfläche auf Panellenebene nach unten-EWLB Hohe Wärmeverteilung Hohe Zuverlässigkeit
Preis: Negotiable
MOQ: Negotiable
Lieferzeit: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... Mehr sehen
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0.5 mm Dicke Panel Ebene Verpackung Panel Ebene BGA/CSP Für Stromadapter
Preis: Negotiable
MOQ: Negotiable
Lieferzeit: Negotiable
Marke: FZX Fanout Process and Product
Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process introduction: After the chip is picked and placed onto the temporary carrier board, the packaging process is carried out by compression molding, plasma c... Mehr sehen
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Panel-Level Verpackung Panel-Level SiP in verschiedenen Branchen verwendet
Preis: Negotiable
MOQ: Negotiable
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: 310*320mm panel size; Advantage:Small SiP package size,such as 6*6mm/7.5*7.5mm;low power consumption;multi-chip packages, high assembly efficiency. Technical capability: different functional dies are assembled in one system,for example, MCU, Bluetooth and some passive chips are assemble... Mehr sehen
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310*320mm Panelgröße Dünner MOS Chip Silizium Niedriger Stromverbrauch
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... Mehr sehen
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LED-Chip Silizium-LED-Konstantenstrom-Treiber-Chip 0,4mm*0,555mm*0,20mm
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the temporary carrier board, press EMC film, etching, then drill the hole, do electrode-plating. Applications: Mini-LED, lamps. Specifications: Chip size 0.... Mehr sehen
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Widerstandschip ((Silizium)
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: Chip size: 0.76*0.61; 1.43 * 1.06； Package size: 2.76*1.97; 2.58 * 2.92； Package thickness: 360um； Process introduction: After the chip is reconstructed to the temporary carrier board, the pick and placement is performed and later plastic compressive molding, followed by grinding, laser... Mehr sehen
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310*320mm Fan-Out Panel Level Packaging (FOPLP) IC Chip ((Silizium)
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: Panel size:310*320mm; Package size: 12*18*0.9mm; Package thickness: 0.9mm; Brief introduction to the process: After the temporary carrier board is attached, plastic sealing and chip reconstruction are done, the first layer of RDL is made, followed by etching +ABF pressing + laser drilli... Mehr sehen
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310*320mm-Fan-Out Panel Level Packaging (FOPLP) GaN-Produkt
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... Mehr sehen
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FOPLP-Verpackung (Fan-Out Panel Level Packaging) - Produktstruktur (Versplitterung) - Waferstoß
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fan-Out Panel Level Packaging
Description: Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement with face-up methodology. The mold grinding, PVD and plating will be made for RDL. The TMV will be made for the top/bot layer connection. The surf... Mehr sehen
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FOPLP-Verpackung (Fan-Out Panel Level Packaging) - Produktstruktur (Versplitterung) - Draht-Bindungskugel
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: As shown in above photo, compared with traditional packaging methods, the wire bond ball (copper or gold) can be made from wire bond process, it is similar to bump of chip, therefore, it has higher integration, high reliability, and low cost; through the FOPLP process , multiple MCU and... Mehr sehen
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FOPLP-Verpackung (Fan-Out Panel Level Packaging) Produktstruktur eingebettete Verpackung
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX
Description: 1,Compared with traditional packaging methods, this advanced packaging replaces wire bond and substrate, therefore, it has demonstrated the characteristic of higher integration, high reliability, and low cost ; 2,While maintaining the original foot position design, it is much thinner an... Mehr sehen
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310*320mm-Fan-Out-Panel Level Packaging (FOPLP) Funkfrequenz (RF)
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: Panel size:310*320mm Package size: 7*6mm Package thickness: 0.75mm Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the back of the plastic sealing material, t... Mehr sehen
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310*320mm-Fan-Out-Panel Level Packaging (FOPLP) MEMS-Mikrofonpaket
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: Plating uniformity: ≤10%; Package size: 3*2mm; Package thickness: 0.26mm; Chip size: 0.96*0.78mm; Process type: FOPLP (310X320mm); Applications: Mobile phone, Bluetooth headset,MEMS, wearable electronics. Specifications: Package size: 3*2mm; Package thickness: 0.26mm; Chip size: 0.96*0.... Mehr sehen
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310*320mm-Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the temporary carrier board, press EMC film, etching, then drill the hole, do electrode-plating. Applications: Mini-LED, lamps Specifications: Chip size 0.4... Mehr sehen
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310*320mm-Fan-Out-Panel Level Packaging (FOPLP) Leistungspaket
Preis: Negotiable
MOQ: 3000pcs
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process flow: face up encapsulation method is adopted. After a single patch, bump, plastic sealing and grinding (exposing the ball), then punch holes and electro... Mehr sehen
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hohe Bildverhältnis TGV
Preis: Negotiable
MOQ: 10 panel
Lieferzeit: 1 month
Marke: FZX -TGV
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:1... Mehr sehen
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Hohe Effizienz, obwohl Loch/blindes Loch auf Glas 35um für GPU/CPU/AI-Chips
Preis: Negotiable
MOQ: 10 panel
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: As shown below photo, the blind or through holes can be made with angle controlling, the laser and acid methodology can be combined together to make customer specific holes. The glass can be coming from different suppliers, e.g., AF32/BF33 (Schott), EAGLE XG or AGC, etc. The shape of ho... Mehr sehen
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Hocheffiziente Glas-Substrat-Platte Größe 510*515mm PVD 300mm-600mm
Preis: Negotiable
MOQ: 10 panel
Lieferzeit: 1 month
Marke: FZX Fanout Process and Product
Description: The panel level PVD can be performed at both sides of the panel simultaneously. It is high efficient and time saving process. The panel sizes are varied within 300mm-600mm. Ti/Cu can be performed as the seed layers. The thickness is controlled with 0.1-2 micro meters. The uniformity in ... Mehr sehen
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Glas-Substrat-Technologie-Doppelseitige Plattierung Stabil und leicht zu warten
Preis: Negotiable
MOQ: 10 panel
Lieferzeit: 1 month
Marke: FZX -plating
Description: The panel plating machine is used for plating, Plating uniformity can achieve below 10%,High aspect ratio of glass through-hole plating can be performed, AR < 10 : 1 1,All pass padding Dia .: 100 μm Cu thick .: 10 μm Glass thick .: 600μm 2,Through hole plating Dia .: 50 μm Cu thick .... Mehr sehen
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