BGA-Substrat
(27)
Schicht ENEPIG BTs FR4 NAND Memory Substrate Board 35/35um 4
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:NAND Memory Substrate Board, BT FR4 Memory Substrate Board, ENEPIG FR4 Package Substrate
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate, Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohmeg... Mehr sehen
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Mikroelektronikpaket-Substratfertigung
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Black Soldermask LED PCB Board, Black Soldermask led lamp pcb, LED PCB Board With total Pad
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPl... Mehr sehen
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BGA-Paket des Gedächtnis-Substrates mit weicher Oberfläche ENEPIG ENIG Gold
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:MicroSD BGA Substrate, TF Memory BGA Substrate, ENEPIG BGA Substrate
MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you send inquiry us,Pls be know that we have to get the following : 1-substrate production sepc. information; 2-Gerber files(substrate designer/engineer ca... Mehr sehen
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Halbleiter BTs materielles Pacakge-Substrat L/S 35/35um
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:BT FR4 BOC Pacakge Substrate, Improved Tenting BOC Pacakge Substrate, BOC Pacakge fr4 substrate
BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate,Semiconductor package; Spec.of pcb production: Mini.Line space/width 1mil (20um) Finished thickness BT (0.1-0.4mm) finished thickness Mainly brand SHENGYI... Mehr sehen
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Des Paketsubstrates Stärke BGA Horexs 0.2mm voller Harzstecker alle Löcher und Kappenüberzug
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:0.2mm Mini PCB Board, Horexs LED PCB Board, Horexs Mini PCB Board
Horexs 0.2mm Thickness full resin plug all holes and cap plating Application:MicroLED,MiniLED,LED display,LED displays; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsui... Mehr sehen
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MicroLED-/MiniLEDpaket-Substratfertigung
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Fine Pitch Micro Pcb Board, Micro Pcb Board No Chromatism, Fine Pitch Pcb For Outdoor Led
Fine Pitch Micro Pcb Board with none misregistration SR Application:LED display,LED displays,Lighting pcb,outdoor Led; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:BT/FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik... Mehr sehen
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ENEPIG-Halbleiterversammlung BGA Rohstoff Substrat-Hitachis BT
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Half Hole BGA Substrate, ENEPIG BGA Substrate, BT FR4 Package Substrate
Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubi... Mehr sehen
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Verpackensubstratherstellung ENIG-Draht-/Paket des Die-Bondes BGA Substrat ICs
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Wire Bond BGA Substrate, ENIG BGA Substrate, IC Packaging Substrate Board
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; M... Mehr sehen
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2-6 Schicht BT-taw Material BGA Verpackensubstrat für Halbleiterversammlung
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:FR4 BGA Substrate, DRAM Memory Chip BGA Substrate, FCBGA Package Substrate
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material... Mehr sehen
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Substrat ENEPIG BTs FR4 4 Schicht-CSP verbesserte Tenting
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:BT FR4 CSP Substrate, 4 Layer CSP Substrate, ENEPIG BGA Package Substrate
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly bran... Mehr sehen
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0.28mm beendeten bleifreie Speicherchipsubstratfertigung
Preis: US 1.3-1.1 each piece
MOQ: 100pieces
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Lead Free Fr4 Printed Circuit Board, 0.25mm Fr4 Printed Circuit Board, 0.25mm Lead Free Circuit Board
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.28mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... Mehr sehen
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Halbleiterpaket Substratproduktion BT-Materials BGA
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:FR4 Finished BGA Substrate, 1mil BGA Substrate, Customize Soldermask BGA Substrate
All types BGA of memory substrate manufacture China Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Short introduction of Horexs Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC subst... Mehr sehen
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Kupfer MCP-Paket Substrat-0.5oz fertigt BT-Material besonders an
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:Immersion Gold FR4 Substrate, 0.5oz Copper MCP Substrate, MCP FR4 Substrate
MCP Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei provinc... Mehr sehen
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IC Chip Substrate Fabrication mit BT (MGC/Hitachi) ENIG/Soft gold/ENEPIG
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:MCP Chip Substrate Board Fabrication, BT ENIG Substrate Board Fabrication, 0.25mm Finished BGA Package Substrate
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finish... Mehr sehen
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BT ENEPIG 4 Schicht-Schlückchen-Paket-Substrat-0.24mm fertige Stärke
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:4 Layer Sip Package Substrate, BT ENEPIG Sip Package Substrate, 0.29mm Finished Package Chip Substrate
Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Sur... Mehr sehen
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Drahtanschluss-Substrat ULs ENIG L/S 30um BT weiches Gold hartes Gold
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:BT Wire Bonding Substrate, 35um Line Wire Bonding Substrate, UL ENIG IC Package Substrate
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,Ohme... Mehr sehen
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FBGA-Paket-Substratproduktion, die Kern BTs 40um stützt
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:4 Layer Flip Chip Substrate, BGA Package Chip Substrate, BT Core FCBGA Substrate
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickn... Mehr sehen
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Halbleiter Verpackensubstrat der D-RAM Gedächtnisfertigung
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:BT FR4 Substrate Board, 35um Line Substrate Board, DRAM Memory Packaging FR4 Substrate
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.15mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-F... Mehr sehen
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Herstellung von Substraten für HF/mmWellenmodule
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:BT Pcb Printed Circuit Board, 2 Layer Pcb Printed Circuit Board, BT Black Pcb Circuit Board
Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-... Mehr sehen
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Verpackensubstrat der 0.2mm Stärkehalbleiterversammlungssubstrat-Mikroelektronik
Preis: US 120-150 per square meter
MOQ: 1 square meter
Lieferzeit: 7-10 working days
Marke: Horexs
Markieren:0.2mm Backlight Pcb, Keyboard Backlight Pcb, 0.2mm keyboard pcb board
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; ... Mehr sehen
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