Wafer-Dicing-Maschine
(5)
0.1mm/s To 600mm/s Wafer Dicing Machine X Axis Cutting Range 260mm
Preis: Negotiable
MOQ: 1
Lieferzeit: 8-10week days
Marke: GaNova
Markieren:0.1mm/s Wafer Dicing Machine, wafer saw machine 260mm, 600mm/s Wafer Dicing Machine
DAD3350 Wafer Dicing Machine 0.1 ～ 600mm/s X-Axis Cutting Range 260mm Improved throughput The DAD3350 achieves improvement in throughput by increasing the speed of each axis. Ease of use Operability is improved with installation of an LCD touch screen and Graphical User Interface (GUI). Easy operati... Mehr sehen
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Silizium-Wafer-Würfelmaschine 260 mm automatische Würfelsäge
Preis: Negotiable
MOQ: 1
Lieferzeit: 8-10week days
Marke: GaNova
Markieren:2.2 kW Wafer Dicing Machine, silicon wafer cutting machine 1.8 kW, silicon wafer dicing machine
DAD3350 Wafer Dicing Machine Automatic Dicing Saw X-Axis Cutting Range 260mm Supports a wide range of applications DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torqu... Mehr sehen
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Automatische Waferwürfelmaschine 8 Zoll 250 mm × 250 mm 300 mm
Preis: Negotiable
MOQ: 1
Lieferzeit: 8-10week days
Marke: GaNova
Markieren:Wafer Dicing Machine 250mm × 250mm, 8 Inch wafer slicing machine, Wafer Dicing Machine 300mm
0.1 ～ 600mm/s Wafer Dicing Machine Φ8 Inch (250 mm × 250 mm, Φ300 mm User-Specified Specification) Supports a wide range of applications DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecti... Mehr sehen
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8-Zoll-Waferwürfelmaschine X-Achsen-Schneidbereich 260 mm 1,8 KW 2,2 KW
Preis: Negotiable
MOQ: 1
Lieferzeit: 8-10week days
Marke: GaNova
Markieren:8 inch Wafer Dicing Machine, wafer cutting machine 260mm, Wafer Dicing Machine X Axis
DAD3350 Wafer Dicing Machine X-Axis Cutting Range 260mm 1.8 KW, 2.2 KW Process quality By adopting a high-rigidity bridge-type frame and a spindle front-section support structure, which prevents heat shrinkage and vibration, a more stable processing point can be achieved. Process controls Auto align... Mehr sehen
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X-Achsen-Schneidbereich 260 mm Wafer-Würfelmaschine Automatische Würfelsäge
Preis: Negotiable
MOQ: 1
Lieferzeit: 8-10week days
Marke: GaNova
Markieren:X Axis Wafer Dicing Machine, Wafer automatic dicing saw, Wafer Dicing Machine 260mm
DAD3350 Wafer Dicing Machine Automatic Dicing Saw 1.8 kW, 2.2 kW Process controls Auto alignment, auto focus, auto kerf check, and other image recognition functions have been installed to improve equipment productivity. In addition, the microscope includes an air blow mechanism and a lens shutter to... Mehr sehen
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