IC-Bindemaschine
(6)
IC-Bindemaschine
Preis: Negotiable
MOQ: ≥1 pc
Lieferzeit: 25~50 days
Marke: Suneast
Markieren:combined selective multi module wave solder, wave soldering multi module combined selective, combined multi module wave solder selective
IC Bonding Machine The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture. IC bonder is suit able for IC... Mehr sehen
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Mehrschicht-IC-Bindemaschine 0,25*0,25mm-10*10mm Die Bonder Ausrüstung
Preis: Negotiable
MOQ: ≥1 pc
Lieferzeit: 25~50 days
Marke: Suneast
Markieren:soldering combined multi module wave selective, selective multi module combined wave soldering, combined wave soldering selective multi module
High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image p... Mehr sehen
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Hochpräzisions-IC-Bindemaschine 8-12 Zoll Wafer Die-Bonders
Preis: Negotiable
MOQ: ≥1 pc
Lieferzeit: 25~50 days
Marke: Suneast
Markieren:combined wave soldering multi module selective, magnetic spring motor ce iso, iso ce magnetic spring motor
Automatic Nozzle Change High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic ... Mehr sehen
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Schnellwechsel-IC-Druckverbindungsmaschine Supermini-Chipverbindungsmaschine
Preis: Negotiable
MOQ: ≥1 pc
Lieferzeit: 25~50 days
Marke: Suneast
Markieren:wave soldering selective combined multi module, multi module combined wave soldering selective, multi module wave soldering selective combined
Supermini Chip Placement Quick Changeover IC Bonder CBD2200 Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips. Featu... Mehr sehen
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Hochgeschwindigkeits-Kleine IC-Bindmaschine Modulplatform Die Bonder-Maschine
Preis: Negotiable
MOQ: ≥1 pc
Lieferzeit: 25~50 days
Marke: Suneast
Markieren:spring motor ce iso magnetic, motor iso magnetic spring ce, selective wave solder multi module combined
Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design Features: High speed, accurate solidification capacity ±10um@3σ; High production efficiency, low cost input High multi-chip processing capacity, support 16 different types of chip placement High flexibility to suppor... Mehr sehen
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Sinterung der Bonder SDB 200
Preis: Negotiable
MOQ: ≥1 pc
Lieferzeit: 25~50 days
Marke: Suneast
Markieren:selective multi module combined wave solder, wave solder combined selective multi module, selective wave solder combined multi module
Automatic Compact Structure Sintering Die Bonder SDB200 Wafer Loading Introduction: It is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achievin... Mehr sehen
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