PWB-Herstellung
(4)
3mil 4mil 3-8oz HDI-PCB-Board-Hersteller 1-28 Schichten
Preis: negotiable
MOQ: Negotiable
Lieferzeit: Negotiable
Marke: Yuetong
Markieren:3oz PCB Board Manufacturer, 8oz PCB Board Manufacturer, 3mil pcb assembly services
HDI PCB Printed Board HDI PCB Printed Board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces and higher connection pad density than employed in conventional PCB technology. HDI board is used to re... Mehr sehen
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8 Schicht Mehrschicht HDI-PCB-Board FR4 1,6 mm TG 180 1 OZ
Preis: negotiable
MOQ: Negotiable
Lieferzeit: Negotiable
Marke: Yuetong
Markieren:8 Layer HDI PCB Board, FR4 HDI PCB Board, 1.6mm hdi pcb manufacturer
Multilayer HDI PCB Board Multilayer HDI PCB Board supplier is providing Quick Turn PCB Prototype Manufacturing services, Low and Medium-volume Printed Circuit Board Manufacturing services. We solemnly do commitment to you, on time delivery, especially the Quick Turn PCB Prototypes 100% on time deliv... Mehr sehen
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Hochdichte mehrschichtige Leiterplatte für medizinische Geräte
Preis: negotiable
MOQ: Negotiable
Lieferzeit: Negotiable
Marke: Yuetong
Markieren:High Density Multilayer Circuit Board, Phone Multilayer Circuit Board, Medical Devices circuit board manufacturing
High Density Multilayer Printed PCB For Phone HDI design requires the latest advances in the PCB interconnection technology: With the latest state of the art PCB technology, HDI PCBs can be defined as those printed circuit boards that make use of some or all of the following features; Blind and buri... Mehr sehen
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8 Schichten ENIG HDI PCB-Leiterplattenherstellung
Preis: negotiable
MOQ: Negotiable
Lieferzeit: Negotiable
Marke: Yuetong
Markieren:8 Layers PCB Fabrication, HDI PCB Fabrication, PCB Circuit Board Fabrication
HDI PCB fabrication is rapidly becoming the ultimate solution for smaller, more efficient, and more durable PCBs. High-Density Interconnect (HDI) is a high-performance design that is characterized by its high density of components and routing Interconnections that use micro vias, blind and buried vi... Mehr sehen
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