Halbleiterformmaschine
(25)
5 Tonnen Kapazität Halbleiterformmaschine mit 12 kW Heizleistung
Preis: Negotiable
MOQ: 1
Lieferzeit: 40 days
Marke: TJIN
Markieren:5Tons Semiconductor Molding Machine, efficient semiconductor molding machine, 5 tons chip molding machine
5 Tons Capacity SM-1000 Semiconductor Molding Machine with 12 KW Heating Power Product Description: Semiconductor Molding Machine - SM-1000 Welcome to the product overview page for the Semiconductor Molding Machine - SM-1000. This innovative and efficient machine is designed to meet the needs of the... Mehr sehen
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PLC-Steuerung IC Chip-Formmaschine
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:PLC Control IC Chip Molding Machine, PLC Control ic packaging equipment
Chip Molding Machine Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● CCD image detection, feeding anti-reverse detection; ● Optional mold vacuum fun... Mehr sehen
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Automatische Halbleiterpressmaschine
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Semiconductor Molding Press Machine, Molding Press semiconductor equipment
Automatic Molding Press Machine Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cake ... Mehr sehen
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Automatische Halbleiterformmaschine
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Auto Transfer Semiconductor Molding Machine, Auto Transfer Molding semiconductor machine
Auto Transfer Molding in Semiconductor Equipment Details: ● Equipped with vision system to recognize the feeding direction; ● WIN10 + 15 inch touch screen + touch keyboard; ● CCD image detection, feeding anti-reverse detection; ● Optional mold vacuum function, isolation mold function, detection func... Mehr sehen
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Automatische Halbleiterverpackungsanlage mit Wasserkühlsystem
Preis: Negotiable
MOQ: 1
Lieferzeit: 40 days
Marke: TJIN
Markieren:automatic semiconductor packaging equipment, automatic semiconductor processing equipment, water cooling semiconductor packaging equipment
Max. Mold Height of 400 Mm Auto Packaging Equipment with Water Cooling System Product Description: Semiconductor Molding Machine - Product Overview The Semiconductor Molding Machine is a high-performance product designed specifically for the semiconductor industry. With a clamping force of 1000 KN, ... Mehr sehen
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PLC-Steuerung Auto Halbleiter-Einkapselungsausrüstung Halbleiterherstellmaschine
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:auto semiconductor encapsulation, auto semiconductor making machine, plc control semiconductor encapsulation
Automatic Encapsulation Equipment Features Product Name: Semiconductor Molding Machine Injection Unit: Single Type: Vertical Injection Molding Machine Platen Size: 600 X 600 Mm Injection Pressure: 200 MPa Screw Diameter: 35 Mm Auto Transfer Molding Auto Packaging Equipment Performance Parameters ● M... Mehr sehen
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Maschine zur Halbleiterformung mit hoher Kapazität von 100 Tonnen
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:semiconductor molding machine automatic, 100 tons semiconductor molding machine, automatic chip molding machine
Automatic Molding Press Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cake loading ... Mehr sehen
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Spritzdruck 200 MPa Halbleiterformmaschine hohe Präzision
Preis: Negotiable
MOQ: 1
Lieferzeit: 40 days
Marke: TJIN
Markieren:200mpa semiconductor molding machine, semiconductor molding machine high precision, 200mpa chip molding machine
Injection Pressure 200 MPa Auto Transfer Molding with Clamping Force 1000 KN Product Description: Semiconductor Molding Machine - Product Overview The Semiconductor Molding Machine is a state-of-the-art piece of equipment designed for high precision molding of semiconductor components. With a capaci... Mehr sehen
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Hocheffiziente Halbleiterformmaschine mit PLC-Steuerung
Preis: Negotiable
MOQ: 1
Lieferzeit: 40 days
Marke: TJIN
Markieren:high efficiency semiconductor molding machine, high efficiency chip molding machine, plc control chip molding machine
Semiconductor Molding Machine With PLC Control System And Max. Mold Height Of 400 Mm Product Description: Semiconductor Molding Machine The Semiconductor Molding Machine is a state-of-the-art product designed for the semiconductor industry. This advanced machine is capable of providing high precisio... Mehr sehen
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Halbleiterformmaschine mit Einzelspritzeinheit mit 35 mm Schraube
Preis: Negotiable
MOQ: 1
Lieferzeit: 40 days
Marke: TJIN
Markieren:single injection unit semiconductor molding machine, 35mm screw chip molding machine, 35mm screw semiconductor molding machine
Injection Pressure 200 MPa Auto Transfer Molding with 35 Mm Screw Diameter Product Description: Product Overview: Semiconductor Molding Machine The Semiconductor Molding Machine, model SM-1000, is a state-of-the-art product designed for the manufacturing of semiconductor products. It is equipped wit... Mehr sehen
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Automatisches Halbleiterformverfahren Halbleiterformgeräte 100 kW
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:semicon molding equipment 100kw, automated semicon molding device, automated semicon molding equipment
Semicon Molding Equipment 【Features】 ● Semiconductor plastic sealing equipment is also known as full-automatic plastic sealing machine, automatic plastic sealing of chips, semiconductor devices and other products. ● Full servo control system, PLC (OMRON) + upper computer; ● WIN10 + 15-inch touch scr... Mehr sehen
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Automatische Plastifizierungspresse Halbleiterherstellungsgeräte Große Kapazität
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:semiconductor manufacturing equipment large capacity, auto plasticizing press semiconductor manufacturing equipment, auto semiconductor processing equipment
Auto Plasticizing Press Product Details: ● WIN10 + 15 inch touch screen + touch keyboard; ● CCD image detection, feeding anti-reverse detection; ● Optional mold vacuum function, isolation mold function, detection function after plastic sealing; ● Use of imported raw materials, high precision, stable... Mehr sehen
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Vollautomatisches effizientes Halbleiterformsystem Halbleitermaschinenhersteller
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:efficient semiconductor molding system, Fully automatic semiconductor machine maker, Fully automatic semiconductor molding system
Fully Automatic Molding System Performance Parameters ● Mold closing pressure: 98-1764kN; ● Injection pressure: 4.9-30kN adjustable; ● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm; ● Applicable molding material size: diameter φ 11-20mm, length/diameter 1... Mehr sehen
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Thermoplastische Halbleiterformgeräte Halbleiterverarbeitungsgeräte 200 MPa
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:thermoplastics semicon molding device, semiconductor processing equipment 200mpa, thermoplastics semiconductor processing equipment
Semicon Molding Device 【Features】 ● Semiconductor plastic sealing equipment is also known as full-automatic plastic sealing machine, automatic plastic sealing of chips, semiconductor devices and other products. ● Full servo control system, PLC (OMRON) + upper computer; ● WIN10 + 15-inch touch screen... Mehr sehen
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Energieeffiziente Halbleiterformmaschine Automatische Verkapselungsgeräte
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Energy Efficient Semiconductor Molding Machine, Semiconductor Molding Encapsulation equipment, Energy Efficient semiconductor processing equipment
Automatic Encapsulation Machine Product Details: ● Standardized mold structure, easy to change; ● High efficiency cake loading component, aluminum box loading; ● Automatic cassette loading, double cassette stacked loading; ● Supports flexible expansion of up to 4 groups of presses to realize high UP... Mehr sehen
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Automatisches Formensystem Halbleiter-Chip-Herstellungsmaschine hohe Effizienz
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Auto Mold Semiconductor Chip Making Machine, Semiconductor Chip Making Machine High Efficiency, Auto Mold chip manufacturing equipment
Auto Mold System Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cake loading compone... Mehr sehen
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Automatische Halbleiterformmaschine mit hoher Kapazität
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Auto Transfer Molding Semiconductor Manufacturing Machine, Semiconductor Manufacturing Machine High Capacity, Auto Transfer Molding semiconductor manufacturing equipment
Applications: Semiconductor Molding Machine - TJIN 001 Product Description The Semiconductor Molding Machine by TJIN is a high-quality and efficient machine designed for use in the production of semiconductors. With a sturdy construction and advanced technology, this machine is perfect for any produ... Mehr sehen
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Hochwertige Halbleiterformmaschine Automatisierte ISO9001-Zulassung
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Semiconductor Molding Machine Automated, Semiconductor Molding Machine ISO9001, Semiconductor Molding System ISO9001
Automatic Molding Machine Performance Parameters ● Mold closing pressure: 98-1764kN; ● Injection pressure: 4.9-30kN adjustable; ● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm; ● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.... Mehr sehen
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100 KW Halbleiterformmaschine Automatisches Verkapselungssystem
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Semiconductor Molding Machine Automatic Encapsulation, 100 KW Semiconductor Molding Machine, Automatic Encapsulation semiconductor equipment
Automatic Encapsulation System Product Details: ● Automatic cassette loading, double cassette stacked loading; ● Supports flexible expansion of up to 4 groups of presses to realize high UPH; ● Equipped with vision system to recognize the feeding direction; ● WIN10 + 15 inch touch screen + touch keyb... Mehr sehen
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100 mm/S Geschwindigkeit Halbleiterformmaschine Chipformgeräte Energieeinsparung
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:100mm/S Semiconductor Molding Machine, Chip Molding Equipment Energy Saving, Semiconductor Molding Machine Energy Saving
Chip Molding Equipment Features: ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● Applicable leadframe/substrat... Mehr sehen
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