Halbleiterformgeräte
(25)
Wasserkühlung Halbleiterverarbeitungsgeräte Halbleiterformsystem Hochdruck
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Water Cooling Semiconductor Processing Equipment, Water Cooling Semicon Molding System, High Pressure Semiconductor Processing Equipment
Semicon Molding System Product Detail: Product Name: Semiconductor Molding Equipment Energy Consumption: Low Control System: PLC Application: Semiconductor Industry Molding Method: Injection Molding Capacity: High Plasticizing Press Plasticizing Press Plasticizing Press PLC Control System ● The auto... Mehr sehen
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1000 Tonnen Halbleiterformgeräte Kunststoffdichtungsgerät hohe Präzision
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:1000 Tons Semiconductor Molding Equipment, Semiconductor Molding Equipment High Precision, semiconductor molding machine High Precision
Automatic Semiconductor Plastic seal Device FAQ: Q: What is the brand name of this product? A: The brand name of this product is TJIN. Q: What is the model number of this product? A: The model number of this product is 002. Q: Where is this product manufactured? A: This product is manufactured in Ch... Mehr sehen
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Vollautomatische Halbleiterformgeräte
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Fully Automatic Semiconductor Molding Equipment, Fully Automatic Semiconductor Molding machine
Fully Automatic Transfer Molding' Features ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cake loading component, aluminum box loading; ● Automatic cassette loading, double cassette stacked loading; ● Supports flexible expansio... Mehr sehen
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Hocheffiziente Halbleiterverpackungsgeräte
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Highly efficient Semiconductor Packaging Equipment, Highly efficient ic packaging Equipment
Semiconductor Packaging Equipment Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cak... Mehr sehen
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Autochip-Einkapselungssystem
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Auto Chip Encapsulation System, Auto Chip encapsulation equipment
Auto Chip Encapsulation System Packing and Shipping: Packaging and Shipping for Semiconductor Molding Equipment Our Semiconductor Molding Equipment is carefully packaged to ensure safe delivery to our customers. Each unit is packed in a sturdy wooden crate with foam padding to protect against any da... Mehr sehen
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Chiptransfer-Formen Halbleiterherstellungsgeräte Wasserkühlung
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Chip Transfer Molding semiconductor manufacturing equipment, Chip Transfer Molding semiconductor manufacturing machine, Semiconductor Manufacturing Equipment Water Cooling
Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art technology and features to ensure effici... Mehr sehen
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Zuverlässige Halbleiterformgeräte funktionieren reibungslos PLC-gesteuert
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Reliable Semiconductor Molding Equipment, Reliable semiconductor molding machine, PLC Controlled Semiconductor Molding Equipment
TJIN Semiconductor Molding Equipment Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art tec... Mehr sehen
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Hochproduktive Halbleiterverpackungsanlage Chipformvorrichtung
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:High Productivity Semiconductor Packaging Equipment, High Productivity Chip Molding Device
Chip Molding Device 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm; Semiconductor plastic seal... Mehr sehen
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Energieeinsparende Halbleiterformgeräte Halbleitertransferform
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Energy Saving Semiconductor Molding Equipment, Energy Saving semiconductor molding machine, Semicon Transfer Molding Equipment
Auto Semicon Transfer Molding Product Description: Semiconductor Molding Equipment Product Overview The Semiconductor Molding Equipment is a fully automatic molding system designed for the production of high-quality semiconductor products. This advanced equipment utilizes state-of-the-art technology... Mehr sehen
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Halbleiterindustrie IC Verpackungsgeräte Chipformsystem automatisiert
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Semiconductor Industry IC Packaging Equipment, Semiconductor Industry Chip Molding System, IC Packaging Equipment Automated
Chip Molding System Semiconductor packaging equipment is mainly used in TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IPM, BGAPDFNOFP and other semiconductor devices, IC , Chip one -stop automatic packaging test. Product Description: Semiconductor Molding Equipment Th... Mehr sehen
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Hocheffiziente Halbleiterformgeräte Chipformsystem 50/60Hz
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:High Efficient Semiconductor Molding Equipment, High Efficient Chip Molding System, Semiconductor Molding Equipment 60Hz
Semiconductor Chip Molding System 【Features】 ● Semiconductor packaging equipment is also known as chip packaging equipment and IC packaging equipment, semiconductor MOLDING packaging equipment; ● Automatic packaging test chip, semiconductor device, IC and other products; ● Full servo control system,... Mehr sehen
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Einfach injizierte Halbleiterformmaschine Vollautomatische Übertragungsgießerei
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Single Injection semiconductor molding machine, Single Injection semiconductor fab equipment, Semiconductor Molding Machine Fully Automatic
Fully Automatic Transfer Molding 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm; ● Full servo ... Mehr sehen
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Ausrüstung für die Herstellung von Halbleitern mit vollständigem automatischem Antrieb für Spritzgießverfahren
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Full Auto Semiconductor Production Equipment, Injection Molding Semiconductor Production Equipment, Injection Molding semiconductor fab equipment
Automatic Molding System Product Description: Semiconductor Molding Equipment Our Semiconductor Molding Equipment is designed specifically for the semiconductor industry and offers a fully automatic molding system with advanced control capabilities. With our state-of-the-art PLC control system, our ... Mehr sehen
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90 kW Halbleiterformgeräte Halbleitertransferformgerät
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:90KW Semiconductor Molding Equipment, Semicon Transfer Molding Device, 90KW semiconductor molding machine
Semicon Transfer Molding 【Performance parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm in length, 0.15-1.2mm thick; ● Applicable plastic seal size: diameter φ 11 ~ 20mm, length/diameter ... Mehr sehen
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Hochproduktive Halbleiterformgeräte
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:High Productivity Semiconductor Molding Equipment, High Productivity Chip Molding System, Chip Molding Semiconductor Molding Equipment
Auto Chip Molding System Technical Parameters: Parameter Value Maintenance Easy Control System PLC Application Semiconductor Industry Capacity High Cycle Time Short Safety Features Advanced Molding Method Injection Molding Precision High Energy Consumption Low Pressure Control Precision Pressure Con... Mehr sehen
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Elektrisch betriebenes Halbleiterformgerät
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Semiconductor Molding Equipment Semicon Encapsulation, Electric Powered Semiconductor Molding Equipment, Electric Powered semiconductor molding machine
Auto Semicon Encapsulation System Features ● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products; ● Full servo control system, PLC (Omron) + controller; ● Standardized mold structure, easy to change; ● High efficiency cak... Mehr sehen
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Chip-Einkapselungssystem Halbleiter-Fab-Ausrüstung Energieeffizient
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Chip Encapsulation semiconductor fab equipment, Semiconductor Fab Equipment Energy Efficient, Chip Encapsulation System Energy Efficient
Auto Chip Encapsulation System Technical Parameters: Attribute Value Product Type Molding Equipment Application Semiconductor Industry Precision High Control System PLC Temperature Control Precision Temperature Control Automation Fully Automated Molding Method Injection Molding Energy Consumption Lo... Mehr sehen
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Automatische Plastifizierungspresse Halbleiter-Chip-Fertigungsmaschinen ISO9001 zertifiziert
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Auto Plasticizing Press Chip Manufacturing Machines, ISO9001 Semiconductor Chip Manufacturing Machines, ISO9001 chip manufacturing equipment
Auto Plasticizing Press Machine Product Detail: ● Full servo control system, PLC (Omron)+upper machine; ● Win10+15 -inch touch screen+touch keyboard; ● CCD image detection, feed anti -counter -anti -detection ● Standardized mold structure, convenient replacement; ● High -efficient ingredients, cakes... Mehr sehen
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Schablonenplastifizierungspresse Halbleiterformgeräte 380V 50Hz
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:Chip Plasticizing Press Semiconductor Molding Equipment, Chip Plasticizing Press semiconductor molding machine, Semiconductor Molding Equipment 380V
Chip Plasticizing Press Customization: TJIN Semiconductor Molding Equipment Customized Service Brand Name: TJIN Model Number: 002 Place of Origin: China Precision: High Capacity: High Maintenance: Easy Control System: PLC Safety Features: Advanced Our company, TJIN, specializes in providing customiz... Mehr sehen
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Maschinen zur Herstellung von Halbleitern mit hoher Automatisierung
Preis: Negotiable
MOQ: 1 set
Lieferzeit: 40 days
Marke: TJIN
Markieren:highly Automation semiconductor fabrication machines, highly Automation Semicon Molding Equipment
Auto Semicon Molding Equipment Technical Parameters: Attribute Value Product Type Molding Equipment Application Semiconductor Industry Precision High Control System PLC Temperature Control Precision Temperature Control Automation Fully Automated Molding Method Injection Molding Energy Consumption Lo... Mehr sehen
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