Halbleiter Packaing-Band
(5)
Spritzen Sie selbsthaftendes Kreppband
Preis: Negotiable
MOQ: 100
Lieferzeit: 7 day
Marke: khj
Sputter Masking Tape Features · After UV light, it is easy to peel off, with a soft buffer layer; · Better conformability and heat resistance. Sticking items condition Measured value (g/25mm) notes SUS Before UV irradiation 960 180°peel SUS After UV irradiation 20 180°peel (200mm/min) Sputter Maskin... Mehr sehen
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De-Aufnehmen des Bands F914WT
Preis: Negotiable
MOQ: 100
Lieferzeit: 7 day
Marke: khj
De-taping Tape is a tape based on PET; the back is coated with a release layer and the front is coated with a rubber adhesive layer. The tape has the characteristics of high peeling force, good adhesion to PE and PVC, and excellent temperature resistance. De-taping Tape can be used for the removal o... Mehr sehen
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Verpackenband des Halbleiters, Verpackenband des Chips, schützender Film des statischen Antipolyimide
Preis: Negotiable
MOQ: 1pcs
Lieferzeit: 3~5days after payment done
Marke: KHJ
Masking Polyimide Heat Resistant Tape Anti Static Silicone Coated Low static heating resistant masking polyimide tapeE1-IH810B heat resistant adhesive tape with good heating resistance IH810B is a polyimide film back coated silicone adhesive with low-adhesion which has excellent antistatic performan... Mehr sehen
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Verpackenband des Halbleiters, Verpackenband des Chips, Film des Bands der hohen Temperatur 0.035mm
Preis: Negotiable
MOQ: 1pcs
Lieferzeit: 3~5days after payment done
Marke: KHJ
Low Static Polyimide High Temperature Kapton Tape 0.035mm OEM ODM Low static high temperature resistant polyimide tape E1-IH810B polyimide heat resistant adhesive tape with good heating resistance IH810B is a polyimide film back coated silicone adhesive with low-adhesion which has excellent antistat... Mehr sehen
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Halbleiter-Verpackungsfolie BR-350M0Y
Preis: Negotiable
MOQ: 100
Lieferzeit: 7 day
Marke: khj
The Semiconductor Packaging film is a release film that uses ultra-high-quality fluoride as the base material for tape casting. It has the characteristics of low surface energy, high melting point, high strength, and high elongation. It is suitable for the release of plastic packaging in the semicon... Mehr sehen
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