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Silikon-freie thermische Auflage
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Auflage 2Kgf/Cm2 4W/M.K Silicone Free Thermal für CPU
Preis: Negotiation
MOQ: Negotiation
Lieferzeit: 3~7 Days
Markieren:4W/m.K silicone free thermal pad, 4W/m.K thermally conductive gap pad, 2Kgf/cm2 thermally conductive gap pad
Hardnss 60 Shore C 4W/mK Thermal Conductive Silicone-Free Gap Filler Pad For CPU Product Description LM-NG400 thermal conductive silicone-free gap filler pad, no silicone oil, no pollution, no oil leakage during long-termhigh-temperature use, especially suitable for heat dissipation of components se... Mehr sehen
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Silikon-freie thermische Auflage 1.8g/Cm3 150psi für GPU
Preis: Negotiation
MOQ: Negotiation
Lieferzeit: 3~7 Days
Markieren:150psi silicone free thermal pad, 1.8g/cm3 thermally conductive gap filler, 150psi thermally conductive gap filler
High Performance Tensile Strength 150psi Silicone-Free Thermal Pad For CUP/GPU Product Description Non-silicone thermal pads are base on special resins. They donot make circuit failure ,because they donot have siloxane volatilization and silicone oil seeping. The products have good tensile strength ... Mehr sehen
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Nicht thermische Gap-Filler-Auflage des Silikon-1.8g/Cc 150psi
Preis: Negotiation
MOQ: Negotiation
Lieferzeit: 3~7 Days
Markieren:150psi thermal gap filler pad, 1.8g/cc thermal gap filler pad, 150psi non silicone thermal pad
1.5W Thermal Pad Tensile Strength 150psi Conductive Silicone-Free Gap Filler Pad Product Description LM-NG150 use special resin system to replace the traditional system of silicone oil, after special curing forming and vacuum processing technology, the silicone-free thermal pad has been made. This p... Mehr sehen
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Silikon-freie thermische Auflage des 5.0mm Stärke-60 Ufer-00 für Festplatte
Preis: Negotiation
MOQ: Negotiation
Lieferzeit: 3~7 Days
Markieren:60 Shore 00 thermal gap filler pad, 60 Shore 00 silicone free thermal pad, 5.0mm thickness thermal gap filler pad
Thickness 0.5~5.0mm Non-Silicone Thermal Pad Thermal Gap Filler Pad For Hard Disk Product Description LM-NG400 is high-performance,thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment,and heat sink or product outer coving. With nice stickin... Mehr sehen
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Silikon-freie thermische Auflage 30psi 2.3g/Cc 2.0W/Mk
Preis: Negotiation
MOQ: Negotiation
Lieferzeit: 3~7 Days
Markieren:2.3g/cc thermal gap pad, 2.0W/mk silicone free thermal pad, 30psi thermal insulation pad
Operating Temperature-40°C ~ 120°C high Thermal Conductivity Silicone-Free Pad Product Description LM-NG300 use special resin system to replace the traditional system of silicone oil, after special curing forming and vacuum processing technology, the Non-silicone thermal pad had been made. This prod... Mehr sehen
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Isolierende Auflage 0.34Mpa 1.2W/M.K Silicone Free Thermal
Preis: Negotiation
MOQ: Negotiation
Lieferzeit: 3~7 Days
Markieren:1.2W/M.K silicone free thermal pad, 1.2W/M.K thermal conductive pad, 0.34Mpa thermal conductive pad
High Thermal Conductivity Silicone-Free Thermal Pad 1.2W/MK Thermal Conductive Pad Product Description Thermal silicone pad is a high-performance heat conducting interface material. Bedding on the gap between the heat device and the heat sink or the machine shell to extrude air to reach the full con... Mehr sehen
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Füller 8kg/Cm2 6.0w/M.K Thermally Conductive Gap
Preis: Negotiation
MOQ: Negotiation
Lieferzeit: 3~7 Days
Markieren:8kg/cm2 GPU Thermal Pad, 6.0w/m.k thermally conductive gap filler, 6.0w/m.k heat dissipation pad
Flame Rating 94-V0 Silicone Free Heat Dissipation Pad Laptop GPU Thermal Pad Product Description The NG series high performance, thermal conductive pad designed with extremely high thermal conductivity and fitting performance, which is from the boron nitride powder of the raw material compound, its ... Mehr sehen
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1.5mm Stärke 12.8W/M.K Electrical Insulation Pad
Preis: Negotiation
MOQ: Negotiation
Lieferzeit: 3~7 Days
Markieren:12.8W/m.k electrical insulation pad, 12.8W/m.k silicone free thermal pad, 1.5mm thickness electrical insulation pad
Thermal Conductive Silicone-Free Gap Filler Pad For CPU Without Silicone Oil Product Description LM-NG280 Silicone-free thermal pad, no siloxane metal oxide filler, no silicone oil, no pollution, no oil leakage during long-termhigh-temperature use, especially suitable for heat dissipation of compone... Mehr sehen
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25 leitfähige Gap Auflage des Ufer-C 2.4g/Cc thermisch für Laptop
Preis: Negotiation
MOQ: Negotiation
Lieferzeit: 3~7 Days
Markieren:2.4g/cc thermal cooling pad, 25 shore C adhesive thermal pad, 2.4g/cc thermal gap pad
Thermal Conductive Cool Silicone Free Gap Pad For High Temperature Product Description Thermal silicone free material is high-performance,thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment,and heat sink or product outer coving. With nice ... Mehr sehen
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60 Auflage Shore00 4.5W/M.K Thermal Interface Material
Preis: Negotiation
MOQ: Negotiation
Lieferzeit: 3~7 Days
Markieren:4.5W/m.K silicon free thermal pad, 60 Shore00 thermal interface pad, 4.5W/m.K heatsink thermal pad
High Quality Size 400*200*1.0MM Heatsink Silicon-Free Thermal Pad Used For RFID Product Description LM-NG450 is a filler thermal interface material with great thermal performance and high compliancy. And it maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out ... Mehr sehen
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Hochtemperatur-Isolierfolie ohne Silikon für Laptops
Preis: Negotiation
MOQ: Negotiation
Lieferzeit: 3~7 Days
Markieren:Insulation Silicone Free Conductive Pad, Laptop Silicone Free Thermal Pad, 15mm Silicone Free Thermal Pad
High Temperature Silicone Free Conductive Pad For Laptop Excellent High Elastic Viscosity Rigorous workmanship,the product is clean and tidy as a whole,without foaming or overflowing glue,and can be cut and processed at will, which can fll the gap well and can dissipate heat after one paste Soft Sho... Mehr sehen
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